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SLP Electroplating Solution , Electroplating Additives For Printed Circuit Board Plating

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Jiangsu Mengde New materials Technology Co.,Ltd.

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SLP Electroplating Solution , Electroplating Additives For Printed Circuit Board Plating

Brand Name : Mengde

Model Number : SLP

Certification : ISO9001

Place of Origin : China

MOQ : 25kg

Price : Negotiation

Payment Terms : T/T

Supply Ability : 10 MT per month

Delivery Time : 20 working days after received your payment

Packaging Details : Packed in a plastic drum

Product Code : SLP

Concentration : ≥50%

Applications : Throwing power, Leveling agent in LCD area for acid copper plating baths

Appearance : Clear transparent liquid

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SLP, Electroplating intermedaite for acid copper, Throwing power, leveling agent in LCD area

Specifications

Concentration	≥50%
Content in Baths	0.02-0.05ml/L
Consumption	1-1.5ml/KAH
Appearance	Clear transparent liquid

Description

SLP has very good throwing power and covering powder, especially is excellent in LCD leveling. It’s normally used as an intermediate of acid copper additive for printed circuit board plating. SLP is very suitable for printed circuit board through-hole filling. No negative effects occurs if SLP is too much in baths, whereas the more SLP is added to baths, the better effects will be in LCD.

Applications

SLP can be combined with other nickel plating intermediates such as SPS, SH110, PN, MT-480 and PEG 6000.
SLP can be applied on the following process:

Acid copper for PCB (Printed Circuit Board) process

Packing and Storage

Packed in a plastic drum, stored in cool and dry place.

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Product Tags:

copper electroplating solution

copper plating additives

Wholesale SLP Electroplating Solution , Electroplating Additives For Printed Circuit Board Plating from china suppliers

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